Non Silicone
For some applications where temperatures never exceed 150 deg C, there is potential to reliably use non-silicone materials. Silicone materials even low oil versions over time can release small amounts of silicone oil which for particularly sensitive applications may cause significant and premature degradation of the overall product. The non-silicone materials have been formulated to provide silicone-like performance but without the negative aspects of silicone thermal interface materials.
Thermal interface materials (TIMs) are highly conductive, conformable materials which are typically used to provide good heat transfer between heat sinks or heat spreaders and electronic devices. Ideal applications for thermal pads exist wherever there are uneven surfaces or component heights, air gaps, large tolerance stack-ups, and poor surface finish that preclude selection of thin bond line pastes and
greases. They can provide an easy solution to thermally connect an electronics board to an external heat sink case for example.
GCS overs a range of non-silicone thermal interface materials. A higher proportion of GCS’s product development programme focuses on advances with non-silicone thermal interface materials.
